Scanning Auger Electron Microprobe (Auger)

  • Rapid sample introduction

  • Low-Z elemental detection

  • Quantitative analysis, mapping, linescan

  • Surface sensitivity

  • Enhanced lateral spatial resolution for elemental analysis (<500A)

  • Limited chemical information

  • Sputter depth profiling (three dimensional analysis)

  • High resolution secondary electron imaging of anlysis area

Atomic Force Microscope (AFM)
  •   Imaging of conducting and non-conducting surfaces

  • Sub-nanometer resolution

  • Imaging in air and liquid, allowing in-situ measurements and real time imaging of biological and chemical processes.

  •  AFM can be used to measure and localize many different forces including: adhesion strength, magnetic forces and mechanical properties. 

  • True 3D imaging and measurements

  • Magnetic, friction, chemical, and phase imaging

 

Field Emission Scanning Electron Microscope (Auger)

  • More information to come!










Scanning Electron Microscope (SEM)

  • Secondary Electron Imaging (SEI)

  • Backscattered Electron Imaging (BEI)

  • Cathodo-Luminescence detection and imaging (CL)

  • Energy Dispersive x-ray Spectroscopy (X-Flash fast X-ray mapping detector)

  • Cryo-preparation chamber with cold/hot stage

  • High-resolution imaging

  • Digital image capture

  • Quantitative elemental analysis of the "bulk" material

  • Fast elemental mapping and/or linescan of area of interest

  • Topographical and density imaging

  • Detection of small variations of trace element content

  • Analysis and Imaging of samples in their natural, hydrated state

Time-of-Flight Secondary Ion Mass Spectrometer (SIMS)
  • Chemical compound identification

  • Elemental and chemical mapping

  • Surface sensitivity

  • Trace element sensitivity (ppm or ppb)

  • Retrospective analysis

  • Analysis of insulating and conducting samples

  • Depth profiling

  • Cold stage

Small-Spot X-ray Photoelectron Spectrometer (XPS)
  • Elemental identification and quantification

  • Chemical functional group identification and quantification

  • Chemical state imaging

  • Surface sensitivity

  • Layer-by-layer depth profiling

  • Minimal sample damage

  • Analysis of insulating and conducting samples

  • Data collection/stage automation

  • Cold stage

X-Ray Powder Diffraction Spectrometer (XRD)
  • Rapid identification of materials

  • Ease of sample preparation

  • Computer-aided material identification

  • Large library of known crystalline structures

  • Multi-sample stage





[Instrumentation] [AFM] [Auger] [FESEM] [SEM] [SIMS] [XRD] [XPS]
[ICAL Staff] [Contacting ICAL]
[Dept. of Physics] [Montana State University]
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